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ESS 500

PRODUCT SPECIFICATIONS:
Max. PCB Size 500 x 500mm (19.7" x 19.7")
Max. Clearance on Solder Side* 25mm (1")*
MAx. Transport Speed6m/min
Transport Angle0°fixed
Position accuracy above fluxer, preheater, and solder nozzle± 0.1mm (± 0.004")
Flux Tank2L Stainless Steel & Fittings, including Flux Level Montioring
Flux Speed Max.6m/min
Spray Width (Nozzle diameter 0.3mm)3mm - 6mm (0.12" - 0.24")
100% IR Preheat1200W
NozzlesWettable, Special
Smallest Nozzle Diameter4.0mm on Wettable Nozzles
Min. Neighbor Component Clearance*1.5 - 3mm (0.06" - 0.12") depending on nozzle type*
Solder CapacityApprox. 15kg (33 lbs.)
Max. Temperature400°C (725°F)
Warm-up TimeApprox. 45 minutes
(N2 Supply) (bottles, tank, or generator suitable, supplied by user)N2-covering over solder bath & pump unit
N2 Pressure2 bar (30 psi)
N2 Consumption0.8 to 1.7 CFM(23-49 liters/min) depending on nozzle shroud
Pressure5.5 bar (80 psi)
Power3 x 230/400V, N, PE, 50/60 Hz
Max. Power Consumption3.0kW
Max. Fuse Rate3 x 16A
Exhaust Power (supplied by customer)150 m3/hour
Exhaust Duct100mm (4") india.
Dimensions
Size Dimensions1440mm L x 1250mm W x 1400mm H (56.7" x 49.2" x 55.1")
Weight180kg (390 lbs.)
News And Events

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BOOTH NO. 1007 & 1009
SMTA SHOW 2016
26, 27 Sept
CHICAGO, US

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BOOTH NO. M25 & M27
6,7,8 Oct
India Paveillion Metalex Vietnam.

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