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Manual Selective Soldering System - MW10

High temperature, lead-free Solder Fountain with blow-thru air nozzle, used for removal and replacement of through-hole components, connectors, etc. mounted on PC boards.



  • Microprocessor based digital controller that regulates solder temperature, wave height, and solder flow duration
  • 10 menu storage
  • Overhead locator laser light pinpoints position for centering components over the wave
  • Height adjustable stainless steel platform
  • Large selection of nozzles for all component sizes
  • Easy to change bayonet mount nozzles for a variety of rework or selective soldering applications
  • "Blow-thru" hot air nozzle option removes solder remaining in through holes during rework process
  • High temperature (350 °C), lead-free operation
  • Available in a Lead only version


Solder type:Hi-temp Lead-free
Max solder temp:662 °F (350 °C)
Solder capacity:50 lbs (23Kg)
Blow-thru air nozzle:N/A
Compressed Air Req'dN/A
Overall dimensions:16" x 26" x 17" (406mm x 660mm x 432mm)
Board Size:8.5" to 18" (203mm to 457mm) L x 16" (406mm) Depth
News And Events

Visit us at

BOOTH NO. 1007 & 1009
SMTA SHOW 2016
26, 27 Sept
CHICAGO, US

Visit us at

BOOTH NO. M25 & M27
6,7,8 Oct
India Paveillion Metalex Vietnam.

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